Why LED Lamps are Getting Darker-2
During the LED package soldering process, the electrode is contaminated by droplets, oil stains and dust, which may lead to poor solder joint welding in SMT;
PCB Assembly Solution: Test the relevant position to ensure that the product quality is ok.
At present, the most widely used non-destructive X-RAY equipment in the market, its powerful penetrating power supplyhttp://www.inspihitek.com/product/energy-product can detect LED bubbles, welding bubbles and other defects;
The selection of solid crystal glue, it needs to be noted that some raw materials have high brightness, but poor thermal conductivity, especially high temperature, it is easy to cause the material to peel off the wafer, causing short circuit boardInspi PCB; For LED defects, the biggest problem is package soldering, so companies need to pay more attention before and after packaging to ensure that the LED package is OK, no bubbles and good soldering.
